Here are the latest Kickstarter updates:
New – Peak Design travel bags: $816,212 pledged by 2,481 backers with 30 days to go.
CamCast – turn your camera into a smart, connected system: $59,902 pledged from 356 backers with 6 days to go.
Shargeek 300 – the next-gen power beast: $539,451 pledged from 2,622 with 23 days to go.
Now available: Spinn Design wrappers (use code SPINN-RUMORS for a discount)
At the 2026 CP+ show, Samyang announced a new AF 35mm f/1.8 P FE full-frame lens with an ultra-compact design, almost identical to the existing AF 85mm f/1.8 P FE and AF 16mm f/2.8 P FE lenses from the Prima series. Here are the key new/updated features from Phototrend:
In the US, some LK Samyang lenses are also sold under the Rokinon brand. In Europe, Smyang lenses are sold at Foto Erhardt and WEX Photo.
Here is some additional information on the Schneider Kreuznach × LK Samyang lens prototypes (previously reported here), courtesy of Phototrend from their CP+ report:
At the 2026 CP+ show in Japan Meike had on display their upcoming Meike AF Air 25mm/35mm/56mm f/1.7 compact APS-C lenses for Sony E, Fujifilm X, Nikon Z (previously reported here). Here are the new details from Phototrend:
Today, GoPro unveiled its new GP3 custom imaging processor. This is a 5nm System-on-a-Chip (SoC) with a dedicated AI Neural Processing Unit (NPU). Key upgrades vs. the GP2:
DxO launched PureRAW 6 with DeepPRIME XD3, now extended to Bayer sensors (previously exclusive to X-Trans sensors), as well as next-generation High-Fidelity DNG compression, delivering significantly smaller files while preserving full RAW integrity and flexibility.
You can get 10% off DxO products with code RUMORS.
Additional information:
Tokina has been very quiet recently, with only one new lens announcement in 2025. At the 2026 CP+ show in Japan, Tokina had a new lens on display labeled “One Lens Like No Other”. This is what we know:
Several Tokina lenses are currently on sale at B&H Photo.
At the 2026 CP+ show in Japan, Sigma’s CEO, Kazuto Yamaki, confirmed that development of the Foveon full-frame sensor is still ongoing but did not provide a release timeframe. He reported steady advancement, “issues have been narrowed”, and the team might reach the next stage – actual full-size sensor manufacturing within 2026. However, he tempered expectations: “I can’t make bold, good reports about productization soon”. Wafer production is infrequent due to reliance on partner lines, requiring repeated cycles of analysis, fixes, and remakes. He reiterated his desire to eventually release a full-frame Foveon camera. The project remains in R&D, with market acceptance still to be evaluated.
